Syllabus for
MTech (VLSI and Embedded Systems)
Academic Year  (2024)

As per University norms

The department is well established with state of art technology to impart knowledge for future industrial and educational needs. It is furnished with sound laboratories outfitted with hi-tech instruments, internet and computer systems. It has acoustic poof class rooms with audio-visual teaching aids. The total campus is networked by wire and Wi-Fi system. It has well experienced faculties from reputed industries and institutions. The department has been made as paperless office. It has personalized syllabus suited for global industrial and academic needs. It is well integrated by standalone seminar hall and supporting auditorium to conduct seminars, workshops and training.

DEPARTMENT VISION To emerge as a centre of academic excellence in the field of Electronics & Communication Engineering to address the dynamic needs of the industry upholding moral values DEPARTMENT MISSION ? Impart in-depth knowledge in Electronics & Communication Engineering to achieve academic excellence. ? Develop an environment of research to meet the demands of evolving technology. ? Inculcate ethical values to promote team work and leadership qualities befitting societal requirements. ? Provide adaptability skills for sustaining in the dynamic environment.

Concept-to-Silicon is the fundamental ideology of this unique M.Tech. Programme designed and delivered by CHRIST (Deemed to be University). Current growth in IC Design (Semiconductors) can be attributed to the advancement in 4G/5G communication, Internet of Things (IoT), AI & ML and lower technology nodes like FINFETs. The advent of these technologies has opened numerous opportunities for the IC Design industry. Due to 4G/5G technology, IoT?s expansion, AI & ML, FINFET based chip designs and Ultra Low Power design needs, IC Design industry would require more people and high quality manpower to churn out new designs with optimized PPA (lesser Power, higher Performance and lesser Area). The increasing growth rates in the Smartphone market, Consumer market, Automotive, Accelerator based server market and IoT could serve as an important source of opportunities and revenue for the IC Design industry. This increases the requirement for quality and skilled IC Design Engineers who are readily deployable to work from day one in the industry. In this programme, students will be lead, from learning communication systems to implementation using the IC Design strategies as per industry standard flows. The Project-based approach is strongly embedded in this MTech. programme that equips every student withindustry ready skills. Students are trained to be independent and qualified in problem-solving skills by end of this programme.

Programme Outcome/Programme Learning Goals/Programme Learning Outcome:

Programme Specific Outcome:

Programme Educational Objective:

• To educate students fundamental RF circuit and system design skills. 

• To introduce students, the basic RF electronics utilized in the industry and how to build up a complex RF system from basis. 

• To offer students experience on designing and simulating RF circuits in computer.

Planning and Preparation, Word Order, Breaking up long sentences, Structuring Paragraphs and Sentences, Being Concise and Removing Redundancy, Avoiding Ambiguity and Vagueness.

Clarifying Who Did What, Highlighting Your Findings, Hedging and Criticising, Paraphrasing and Plagiarism, Sections of a Paper, Abstracts. Introduction

Review of the Literature, Methods, Results, Discussion, Conclusions, The Final Check

Key skills are needed when writing a Title, key skills are needed when writing an abstract, key skills are needed when writing an Introduction, skills needed when writing a Review of the Literature.

Skills needed when writing the Methods, skills needed when writing the Results, skills are needed when writing the Discussion, skills are needed when writing the Conclusions.

Useful phrases, how to ensure paper is as good as it could possibly be the first- time submission

T2.Day R (2006) How to Write and Publish a Scientific Paper, Cambridge University Press

R2. Adrian Wallwork, English for Writing Research Papers, Springer New York Dordrecht Heidelberg London, 2011.

ESE-50 marks

The objective of this course is to make the students understand the meaning of research and how to formulate the problem statement by undergoing different methodologies used I research. This course also gives an insight about the intellectual property rights which is very essential to any research engineer.  

Meaning of research problem, Sources of research problem, Criteria Characteristics of a good research problem, Errors in selecting a research problem, Scope and objectives of research problem. Approaches of investigation of solutions for research problem, data collection, analysis, interpretation, Necessary instrumentations, Effective literature studies approaches, analysis Plagiarism , Research ethics

Effective technical writing, how to write report, Paper Developing a Research Proposal, Format of research proposal, a presentation and assessment by a review committee

Nature of Intellectual Property: Patents, Designs, Trade and Copyright. Process of Patenting and Development: technological research, innovation, patenting, development. International Scenario: International cooperation on Intellectual Property. Procedure for grants of patents, Patenting under PCT .

Patent Rights: Scope of Patent Rights. Licensing and transfer of technology. Patent information and databases. Geographical Indications.

New Developments in IPR: Administration of Patent System. New developments in IPR; IPR of Biological Systems, Computer Software etc. Traditional knowledge Case Studies, IPR and IITs..

·       Wayne Goddard and Stuart Melville, “Research Methodology: An Introduction”

·       Ranjit Kumar, 2 nd Edition , “Research Methodology: A Step by Step Guide for beginners”

·       Halbert, “Resisting Intellectual Property”, Taylor & Francis Ltd ,2007.

·       

·       Niebel , “Product Design”, McGraw Hill, 1974.

·       Asimov , “Introduction to Design”, Prentice Hall, 1962.

·       Robert P. Merges, Peter S. Menell, Mark A. Lemley, “ Intellectual Property in New Technological Age”, 2016.

·       T. Ramappa, “Intellectual Property Rights Under WTO”, S. Chand, 2008

• This course is an introduction to the basic concepts of MOS transistors

• It provides a platform for transistor level digital circuits design.

• The information gained can be applied to different logical implementations.

NMOS and PMOS Transistors – Threshold Voltage – Body Effect – Second-order Effects – Transient response, Rise time, Fall Time-Pseudo NMOS Logic-Transistor equivalency-NMOS and CMOS Inverters – Inverter Ratio

CMOS Logic Structures–MOS logic circuits with NMOS loads, Primitive CMOS logic gates – NOR & NAND gate, Complex Logic circuits design – Realizing Boolean expressions using NMOS gates and CMOS gates, AOI and OIA gates, CMOS full adder, CMOS transmission gates, Designing with Transmission gates-Static CMOS Design – Dynamic CMOS Design – Parasitic Estimation – Switching Characteristics.

Introduction to Sequential Circuit Design and Timing Analysis-Behavior of bistable elements, SR Latch, Clocked latch and flip flop circuits, CMOS D latch, and edge triggered flip-flop-Electro static discharge (ESD) – Latch up and its Prevention

Basic principle, Voltage Bootstrapping, Synchronous dynamic pass transistor circuits, Dynamic CMOS transmission gate logic, High performance Dynamic CMOS circuits

Introduction, Memory organization, types, MOS decoders, Static RAM cell design, DRAM cell design, three-transistor and one transistor dynamic cell Flash memory FRAMS

T2. Sung-Mo Kang and Yusuf Leblebici, CMOS Digital Integrated Circuits - Analysis and Design, Third Edition, Tata McGraw-Hill, 2003. 

T3. Neil H. E. Weste and David Money Harris, CMOS VLSI Design: A Circuits and Systems Perspective, Fourth Edition, Addison Wesley, 2010.

T4. Ken Martin, “Digital Integrated Circuit Design”, Oxford University Press, 2011.

R2. Jan M. Rabaey, Anantha Chandrakasan, Borivoje Nikolic, “Digital Integrated Circuits – A Design Perspective”, 2nd Edition, PHI.

ESE-50 marks

• To provide students with the necessary basic understanding and knowledge in semiconductors so that they understand various applications in discrete and integrated analogue electronic circuits.

• To understand the operation principle of Diode, BJT and MOSFET. 

• To provide the students a basic knowledge as well as hands on experiences on device and circuit level modeling on primitive semiconductor devices such as diode, transistor, MOSFET, and some basic compound semiconductor devices.

Review of semiconductor fundamentals, Energy band, Carrier transport phenomena, Recombination and generation, surface effects, traps, Poisson’s equation, continuity equation, diffusion equation\drift, current flow equation, finite difference formulation of these equations in 1D and 2D. 

Types of Semiconductors: Elemental and compound semiconductors, Narrow & wide energy gap semiconductors, Direct & Indirect semiconductors, Choice of semiconductors for specific applications.

PN Junction, Zener and Schottky diode DC characteristics, Static, Large and Small signal model of diode, Ideal vs Real Diode Mode.  BJT: DC Characteristics, Eber’s Moll Model, Gummel-Poon Model, Frequency limitation, Non Ideal effects.

FET/MOSFET: Steady state Characteristics-DC transfer characteristics, long channel IV, MOSFET CV characteristics, Channel Length Modulation, Sub threshold conduction, Mobility variation, Velocity saturation threshold voltage modifications, Threshold adjustment by ion implantation, lightly doped drain MOS transistor, Breakdown voltage, Radiations and Hot electron effects. Leakage and current conduction mechanism of MOSFET. Charge Control Model, Charge sharing model, Static, small and large signal model of MOSFET.

Introduction to modern VLSI Devices, Polysilicon emitter transistors, Heterojunctions, 2D electron gas, Band alignment, SOI MOSFETs, PDSOI, FDSOI, Source/drain engineering, Brief Introduction to HEMTS, MESFET (Metal semiconductor FET) and MODFET (Modulation doped FET), Single Electron Transistor (SET).

Introduction to SPICE modeling, Growth of fables design industry, SPICE modeling of resistor, Capacitor, Inductor, Semiconductor devices such as Diode, BJT, FET, MOSFET.MOSFET model parameters, Introduction to MOSFET SPICE Level 1, Level 2 and Level 3 models. 

Introduction to Device simulators, Tools for simulating device performance, Introduction to Circuit simulators

T2 Taur and Ning, “Fundamental of Modern VLSI Devices”, 2 nd Edition, Cambridge Press, 2016. 

T3 Balbir Kumar, Shail B. Jain, “Electronic Devices and Circuits”, PHI Publication, 2013.

R2. G. Milnes, “Semiconductor Devices and Integrated Electronics”, Springer, 2012. 3 Jan M.Rabaey” Digital Integrated Circuits: A design perspective”, Pearson, 2016.

ESE-50 marks

• This course is an introduction to the Verilog language. The emphasis is on writing synthesizable code and enough simulation code to write a viable test-bench. 

• The information gained can be applied to any digital design by using a top-down synthesis design approach.

Digital Systems and Embedded Systems, Boolean Functions and Boolean algebra, Binary Coding, Combinational Components and Circuits, Verification of Combinational Circuits.

Storage elements, Counters, Sequential Data paths and Control, Clocked Synchronous Timing Methodology. Memories: Concepts, Memory Types, Error Detection and Correction

ICs, PLDs, Packaging and Circuit Boards, Interconnection and Signal Integrity. Processor Basics: Embedded Computer Organization, Instruction and Data, Interfacing with memory

I/O devices, I/O controllers, Parallel Buses, Serial Transmission, I/O software. Accelerators: Concepts, case study, Verification of accelerators. Design Methodology: Design flow, Design optimization, Design for test.

Introduction of Simple Single Cycle and Multi Cycle Processor Design

T2. Peter.J.Ashenden, “Digital Design: An Embedded Systems Approach Using Verilog”, Elsevier 2010

R2. Z. Navabi, Verilog Digital System Design, Second Edition, Tata McGrawHill, 2008. 

R3. R. C. Cofer and B. F. Harding, Rapid System Prototyping with FPGAs: Accelerating the Design Process, Elsevier/Newnes, 2005.

R4. Peter J. Ashenden, “Digital Design: An Embedded Sytems Approach Using VERILOG”, Elsevier, 2010

ESE-50 marks

To study the hardware and software used in Embedded Systems.

To understand the system architecture of SoC design

Definition and Classification – Overview of Processors and hardware units in an embedded system – Software embedded into the system – Exemplary Embedded Systems – Embedded Systems on a Chip (SoC) and the use of VLSI designed circuits.

I/O Devices - Device I/O Types and Examples – Synchronous - Iso-synchronous and Asynchronous Communications from Serial Devices - Examples of Internal Serial-Communication Devices - UART and HDLC - Parallel Port Devices - Sophisticated interfacing features in Devices/Ports- Timer and Counting Devices - ‘12C’, ‘USB’, ‘CAN’ and advanced I/O Serial high speed buses- ISA, PCI, PCI-X, cPCI and advanced buses.

Programming in assembly language (ALP) vs. High Level Language - C Program Elements, Macros and functions -Use of Pointers - NULL Pointers - Use of Function Calls – Multiple function calls in a Cyclic Order in the Main Function Pointers – Function Queues and Interrupt Service Routines Queues Pointers – Concepts of EMBEDDED PROGRAMMING in C++ - Objected Oriented Programming – Embedded Programming in C++, ‘C’ Program compilers – Cross compiler – Optimization of memory codes.

Components of the system – Processor architectures – Memory and addressing – system level interconnection – SoC design requirements and specifications – design integration – design complexity – cycle time, die area and cost, ideal and practical scaling, area-time-power tradeoff in processor design, Configurability.

Overview – soft processors, processor core selection. Basic concepts – instruction set, branches, interrupts and exceptions. Basic elements in instruction handling – Minimizing pipeline delays – reducing the cost of branches – Robust processors – Vector processors, VLIW processors, Superscalar processors.

SoC external memory, SoC internal memory, Scratch pads and cache memory – cache organization and write policies – strategies for line replacement at miss time – split I- and D- caches – multilevel caches – SoC memory systems – board-based memory systems – simple processor/memory interaction. Bus architectures – SoC standard buses – AMBA, AHB.

R2. David E.Simon, An Embedded Software Primer, Pearson Education Asia, Twelfth  Indian Reprint 2005.

R3. Wayne Wolf, Computers as Components; Principles of Embedded Computing System Design – Harcourt India, Morgan Kaufmann; 2 edition (8 July 2008).

R4. Frank Vahid and Tony Givargis, Embedded Systems Design – A unified Hardware /Software Introduction, John Wiley & Sons  2002.

ESE - 50 marks

To familiarize the students about basic CMOS IC design as well to provide hands on experiences on CMOS digital IC design

1. Characterization of NMOS and PMOS transistors for analog figure of merits
2. Obtain VTC curve and threshold voltage of inverter for a specific parameter, verify with the value of threshold voltage obtained using formula
3. Design NAND and NOR gate perform all the analysis
4. Design XOR gate by using NAND and NOR gate. Perform transient analysis
5. Design 1-bit half adder and verify the circuit using transient analysis
6. Design Full adder and verify the circuit using transient analysis
7. Design CMOS transmission gate and perform all the analysis to verify its characteristics
8. Design NOR gate using Domino logic CMOS inverter and verify its characteristics.
9. Design a MOS based SRAM cell and verify its characteristics

T1. Jan M. Rabaey, Anantha P. Chandrakasan and BorivojeNikolić, Digital Integrated Circuits: A Design Perspective, Second Edition, Prentice Hall India, 2003.

 T2. Sung-Mo Kang and Yusuf Leblebici, CMOS Digital Integrated Circuits - Analysis and Design, Third Edition, Tata McGraw-Hill, 2003.

T3. Neil H. E. Weste and David Money Harris, CMOS VLSI Design: A Circuits and Systems Perspective, Fourth Edition, Addison Wesley, 2010.

T4. Ken Martin, “Digital Integrated Circuit Design”, Oxford University Press, 2011.

R2. Jan M. Rabaey, Anantha Chandrakasan, Borivoje Nikolic, “Digital Integrated Circuits – A Design Perspective”, 2nd Edition, PHI.

To provide the students a basic knowledge as well as hands on experiences on device and circuit level modeling on primitive semiconductor devices such as diode, transistor, MOSFET, and some basic compound semiconductor devices.

1. IV Characteristics of a Diode and BJT using MATLAB
2. IV Characteristics of a MOSFET using MATLAB
3. Analyzing Short Channel Effect of a MOSFET using MATLAB
4. Band structure analysis of Compound Semiconductor using MATLAB
5. Leakage Current Conduction mechanism of a MOSFET using MATLAB
6. DC and Transient analysis of Resistance and Capacitance using SPICE
7. DC and Transient analysis of Diode and BJT using SPICE
8. Level1 Model of MOSFET using SPICE
9. Level2 and Level 3 MOSFET modelling using SPICE

T2. Taur and Ning, “Fundamental of Modern VLSI Devices”, 2 nd Edition, Cambridge Press, 2016. 

T3. Balbir Kumar, Shail B. Jain, “Electronic Devices and Circuits”, PHI Publication, 2013.

R2.A. G. Milnes, “Semiconductor Devices and Integrated Electronics”, Springer, 2012. 3 Jan M.Rabaey” Digital Integrated Circuits: A design perspective”, Pearson, 2016.

1.  Understand value of education and self- development

2.  Imbibe good values in students

3.  Let the should know about the importance of character

• Values and sell-development —Social values and individual attitudes. Work ethics, Indian vision of humanism.
• Moral and non- moral valuation. Standards and principles.
• Value judgements               

•Importance of cultivation of values.

•Sense of duty. Devotion, Self-reliance. Confidence, Concentration. Truthfulness, Cleanliness.

•Honesty, Humanity. Power of faith, National Unity.

•Patriotism.Love for nature ,Discipline

•Personality and Behavior Development - Soul and Scientific attitude. Positive Thinking. Integrity and discipline.

•Punctuality, Love and Kindness.

•Avoid fault Thinking.

•Free from anger, Dignity of labour.

•Universal brotherhood and religious tolerance.

•True friendship.

•Happiness Vs suffering, love for truth.

•Aware of self-destructive habits.

•Association and Cooperation.

•Doing best for saving nature

•Character and Competence —Holy books vs Blind faith.

•Self-management and Good health.

•Science of reincarnation.

•Equality, Nonviolence ,Humility, Role of Women.

•All religions and same message.

•Mind your Mind, Self-control.

•Honesty, Studyingeffectively

1 Chakroborty, S.K. "Values and Ethics for organizations Theory and practice", Oxford University Press, New Delhi

Assessment of each paper

• Continuous Internal Assessment (CIA) for Theory papers: 50% (50 marks out 

of 100 marks)

• End Semester Examination(ESE) : 50% (50 marks out of 100 marks)

Components of the CIA 

CIA I:   Mid Semester Examination (Theory): 25 marks

CIA II:  Assignments : 10 marks 

CIA III: Quizzes/Seminar/Case Studies/Project Work   : 10 marks

Attendance: 05 marks

Total: 50 marks

Students will be able to

 Review existing evidence on the review topic to inform programme design and policy making undertaken by the DfID, other agencies and researchers.

Identify critical evidence gaps to guide the development.

1. To learn to achieve the highest goal happily

2. To become a person with stable mind, pleasing personality and determination

3. To awaken wisdom in students 

Statements of basic knowledge. · Shrimad BhagwadGeeta: Chapter2-Verses 56, 62, 68 · Chapter 12 -Verses 13, 14, 15, 16,17, 18 · Personality of Role model. Shrimad BhagwadGeeta: Chapter2-Verses 17, Chapter 3-Verses 36,37,42, · Chapter 4-Verses 18, 38,39 · Chapter18 – Verses 37,38,63 

To introduce the technology, Subsystem design concepts and testing of Very Large Scale Integrated Circuits.

VLSIdesign automation tools- algorithms and system design.  Structural and logic  design.  Transistor  level design. Layout design.  Verification  methods.  Design management tools.

Layout compaction, placement and routing. Design   rules, symbolic layout. Applications of   compaction. Formulation methods.  Algorithms for constrained graph compaction.  Circuit   representation.  Wire  length estimation.   Placement algorithms. Partitioning algorithms.

Floor planning and routing- floor planning concepts. Shape functions and floor   planning sizing.   Local routing. Area routing.  Channel routing,  global routing and its algorithms.

Simulation and logic synthesis-  gate   level  and   switch  level   modeling   and   simulation. Introduction to combinational logic synthesis. ROBDD  principles, implementation,  construction and manipulation.  Two level logic synthesis.

High-level synthesis-    hardware    model    for  high    level    synthesis.    Internal representation  of input algorithms.  Allocation, assignment  and scheduling.  Scheduling algorithms. Aspects of assignment.   High level transformations

T1. S.H.  Gerez, “Algorithms for VLSI Design Automation”,  John Wiley ,1998.
T2. N.A.Sherwani ,  “Algorithms for VLSI Physical Design Automation”, (3/e),  Kluwer,1999.

R2. M.Sarrafzadeh, “Introduction to VLSI  Physical  Design”,  McGraw Hill (IE), 1996

ESE - 50 marks

•This course addresses a profound analysis on the development of the CMOS & BiCMOS digital circuits for a low voltage low power environment. 

•To study the concepts of device behavior and modelling.

•To study the concepts of low voltage, low power logic circuits.

Hierarchy of limits of power – Sources of power consumption – Physics of power dissipation in CMOS FET devices – Basic principle of low power design.

Logic level power optimization – Circuit level low power design – Circuit techniques for reducing Power consumption in adders and multipliers.

Computer arithmetic techniques for low power system – reducing power consumption in memories – low power clock, Inter connect and layout design – Advanced techniques –Special techniques.

Power Estimation technique – logic power estimation – Simulation power analysis –Monte-Carlo power Estimation, Advanced sampling Techniques, Vector Compaction – Probabilistic power analysis–combinational circuits, Real-Delay gate power Estimation, Sequential Circuits.

Synthesis for low power – Behavioral level transforms, logic level optimization, Circuit level – software design for low power- sources of software power dissipation, software power estimation, software power optimizations, Automated low power code generation.

2. DimitriosSoudris, Christians Pignet, Costas Goutis, “Designing CMOS Circuits for Low Power”, Kluwer, 2002.

2. A.P.Chandrasekaran and R.W.Broadersen, “Low power digital CMOS design”, Kluwer,1995

3. Gary Yeap, “Practical low power digital VLSI design”, Kluwer, 1998

4. Abdelatif Belaouar, Mohamed.I.Elmasry, “Low power digital VLSI design”, Kluwer, 1995

5. James B.Kulo, Shih-Chia Lin, “Low voltage SOI CMOS VLSI devices and Circuits”, JohnWiley and sons, inc. 2001.

• Study of parallel processing and program flow control in a processor.
• Study of multiprocessor and multicomputer.
• To be acquainted with memory organization of processors.

Thestate of computing, Classification of parallel computers, Multiprocessors and multicomputer, Multifactor and SIMD computers. Program and network properties: Conditions of parallelism, Data and resource Dependences, Hardware and software parallelism, Program partitioning and scheduling, Grain Size and latency, Program flow mechanisms, Control flow versus data flow, Data flow Architecture, Demand driven mechanisms, Comparisons of flow mechanisms.

Network properties and routing, Static interconnection Networks, Dynamic interconnection Networks, Multiprocessor system Interconnects, Hierarchical bus systems, Crossbar switch and multiport memory, Multistage and combining network.

Introduction to cache memory, memory hierarchy and cache memory, Cache architecture and cache policies. CONCEPT OF FLUSHING AND CLEANING CACHE: Flushing and Cleaning ARM cache core.CONCEPT OF CACHE LOCKDOWN: Locking Code and Data in Cache. Cache and write buffer.

Linear pipeline processor, nonlinear pipeline processor, Instruction pipeline Design, Mechanisms for instruction pipelining, Dynamic instruction scheduling, Branch Handling techniques, branch prediction, Arithmetic Pipeline Design, Computer arithmetic principles, Static Arithmetic pipeline, Multifunctional arithmetic pipelines Memory Hierarchy Design: Cache basics & cache performance, reducing miss rate and miss penalty, multilevel cache hierarchies, main memory organizations, design of memory hierarchies.

Symmetric shared memory architectures, distributed shared memory architectures, models of memory consistency, cache coherence protocols (MSI, MESI, and MOESI), scalable cache coherence, overview of directory based approaches, design challenges of directory protocols, memory based directory protocols, cache based directory protocols, protocol design tradeoffs, and synchronization. Scalable point –point interfaces: Alpha364 and HT protocols, high performance signalling layer. Enterprise Memory subsystem Architecture: Enterprise RAS Feature set: Machine checks, hot add/remove, domain partitioning, memory mirroring/migration, patrol scrubbing, fault tolerant system.

T2. Introduction to Parallel Computing, 2nd Edition, Pearson Education by Ananth Grama, Anshul Gupta, George Karypis, Vipin Kumar.

R2. Computer Architecture and Parallel Processing, by K.Hwang and F.A. Briggs. Mc Graw Hill, International

ESE - 50 marks

To introduce the technology, Subsystem design concepts and testing of Very Large Scale Integrated Circuits.

Introduction - Need for testing - VLSI Testing Process and Test Equipment - Types of testing - ATE – ADVANTEST model T6682-Block Diagram and Specification– Electrical parametric testing – Single Stuck at faults.

Faults in Digital circuits-failures and faults. Algorithms and Representations - Redundancy Identification (RID) - Test generation for combinational logic circuits-combinational ATPG-Boolean Difference Method-D-Algorithm-PODEM - FAN Algorithm.

Design for Testability – Ad-hoc design – generic scan based design – classical scan based design – system level DFT approaches.

Built-In self-Test – Test pattern generation for BIST – Circular BIST – BIST Architectures – Testable Memory Design – Test Algorithms – Test generation for Embedded RAMs.

Logical Level Diagnosis – Diagnosis by UUT reduction – Fault Diagnosis for Combinational Circuits – Self-checking design – System Level Diagnosis.

T2. M.L.Bushnell and V.D.Agrawal, “Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits”, Kluwer Academic Publishers, 2002.

R2. A.L.Crouch, “Design Test for Digital IC’s and Embedded Core Systems”, Prentice Hall International, 2002.

R3. Neil H.E. Weste, “Principles of CMOS VLSI Design A Systems Perspective” Second Edition, 2000.

ESE - 50 marks

 Starting from high level design entry in the form VHDL/Verilog codes, the students will be carrying out complete hardware level FPGA validation of important digital algorithms. 

1. Design Entry Using VHDL
2. Verilog examples for Digital circuit descriptions using HDL languages sequential, concurrent statements and structural description.
3. Understanding Synthesis principles.
4. Back annotation.
5. Test vector generation and timing analysis of sequential and combinational logic design realized using HDL languages.
6. FPGA real time programming and I/O interfacing.
7. Interfacing with Memory modules in FPGA Boards.
8. Verification of design functionality implemented in FPGA by capturing the signal in DSO.
9. Real time application development.

Practical  - 35

Theory CIA : 30 Marks

Theory ESE : 30 Marks

Attendance : 5 Marks

To provide the students a basic knowledge as well as hands on experiences on FPGA devices  & interfacing with VHDL/Verilog languages

1. Design Entry and Simulation of Combinational Circuits
2. Place and Route and Post Place & Route Simulation
3. Design and FPGA Implementation of Combinational Circuits
4. Design and FPGA Implementation of Sequential Circuits
5. Analysis of Area, Power and Delay for Sequential Circuits
6. Invoke PLL to generate Real Time Clock
7. Memories: ROMs and BRAMs Internal to the FPGA
8. Memories: External SPI Flash and DDR2
9. Interfacing FPGA board with AC’97 Codec
10. PS2 Keyboard and UART
11. Interfacing FPGA board with Host Computer via USB
12. Video Interfaces: HDMI and DVI
13. PicoBlaze – an embedded microcontroller
14. Single Cycle Computer

T2.Verilog HDL: Samir Palnitkar,2 edition,Pearson Education,2003.

T3.P.P. Chu, RTL Hardware Design Using VHDL: Coding for Efficiency, Portability and Scalability, Wiley-Interscience, 2006.

T4.Peter.J.Ashenden, Digital Design : An Embedded Systems Approach  Using      Verilog, Elesvier 2010

R2.Ken Chapman, PicoBlaze 8-Bit Microcontroller for Virtex-E and Spartan-II/IIE Devices. Xilinx

R3. HDMI and DVI pointers: --HDMI resource center; http://www.hdmi.org/learningcenter/--Wikipedia HDMI introduction; http://en.wikipedia.org/wiki/HDMI--HDMI specification document Version 1.3; see file included in this lab archive; --HDMI Hider: TI TMDS141 (datasheet of the chip on the Atlys board); 

R4.  Tony Storey and Scott Larson, AC’97 Codec Hardware Driver Example. 

https://forum.digikey.com/t/ac97-codec-hardware-driver-example/13194

R5.  Johannes Hausensteiner, SPI Controller in VHDL. 

http://opencores.org/project,spiflashcontroller

R6. Datasheet Numonyx N25Q12 Serial Flash memory. http://www.alldatasheet.com/datasheetpdf/pdf/353314/NUMONYX/N25Q128.html

To enable the students to understand and interpret different concepts in IoT and help them in building new applications

Review of computer communication concepts (OSI layers, components, packet communication, Networks, TCP-IP, subnetting, IPV4 addressing and challenges). IPV6 addressing. IoT architecture reference layer, Characteristics IoT sensor nodes, Edge computer, Open SourceHardwares

Review of computer communication concepts (OSI layers, components, packet communication, Networks, TCP-IP, subnetting, IPV4 addressing and challenges). IPV6 addressing. IoT architecture reference layer, Characteristics IoT sensor nodes, Edge computer, Open SourceHardwares

IoT Technology- Devices and gateways, Local and wide area networking, Data management, Business processes in IoT, M2M and IoT Analytics, Knowledge Management, Real-World Design Constraints- Introduction, Technical Design constraints-hardware is popular again, Data representation and visualization, Interaction and remote control.

IoT Technology- Devices and gateways, Local and wide area networking, Data management, Business processes in IoT, M2M and IoT Analytics, Knowledge Management, Real-World Design Constraints- Introduction, Technical Design constraints-hardware is popular again, Data representation and visualization, Interaction and remote control.

Virtualization concepts and Cloud Architecture, Cloud computing, benefits Cloud services -- SaaS, PaaS, IaaS, Cloud providers & offerings, Study of IOT Cloud platforms, ThingSpeak API and MQTT,  Interfacing ESP8266 with Web services

Virtualization concepts and Cloud Architecture, Cloud computing, benefits Cloud services -- SaaS, PaaS, IaaS, Cloud providers & offerings, Study of IOT Cloud platforms, ThingSpeak API and MQTT,  Interfacing ESP8266 with Web services

Structured Vs Unstructured Data and Data in Motion Vs Data in Rest, Role of Machine Learning-No SQL Databases, Hadoop Ecosystem, Apache Kafka, Apache Spark, Edge Streaming Analytics and Network Analytics, Xively Cloud for IoT, Python Web Application Framework, Django, AWS for IoT, System Management with NETCONF-YANG, Kibana, Faulttolerant data processing on devices

Structured Vs Unstructured Data and Data in Motion Vs Data in Rest, Role of Machine Learning-No SQL Databases, Hadoop Ecosystem, Apache Kafka, Apache Spark, Edge Streaming Analytics and Network Analytics, Xively Cloud for IoT, Python Web Application Framework, Django, AWS for IoT, System Management with NETCONF-YANG, Kibana, Faulttolerant data processing on devices

David Boyle, “From Machine to Machine to Internet of Things”, Elsevier Publications, 2014

 2. Vijay Madisetti , Arshdeep Bahga, Adrian McEwen (Author), Hakim Cassimally

“Internet of Things A Hands-on-Approach” Arshdeep Bahga & Vijay Madisetti, 2014

R2. Bernd Scholz-Reiter, Florian Michahelles, “Architecting the Internet of Things”, ISBN 978-3-642-19156-5 e-ISBN 978-3-642-19157-2, Springer

R3. Daniel Minoli, “Building the Internet of Things with IPv6 and MIPv6: The Evolving World of M2M Communications”, ISBN: 978-1-118-47347-4, Willy Publications

ESE-50

This course aims at making the students get an understanding of the compression techniques available for multimedia applications and also get an understanding of the encryption that can be implemented along with the compression.

Compaction techniques – Huffmann coding – Adaptive Huffmann Coding – Arithmatic coding – Shannon-Fano coding – Dictionary techniques – LZW family algorithms

Compaction techniques – Huffmann coding – Adaptive Huffmann Coding – Arithmatic coding – Shannon-Fano coding – Dictionary techniques – LZW family algorithms

Compaction techniques – Huffmann coding – Adaptive Huffmann Coding – Arithmatic coding – Shannon-Fano coding – Dictionary techniques – LZW family algorithms

Compaction techniques – Huffmann coding – Adaptive Huffmann Coding – Arithmatic coding – Shannon-Fano coding – Dictionary techniques – LZW family algorithms

Video compression techniques and standards – MPEG Video Coding I: MPEG – 1 and 2 – MPEG Video Coding II: MPEG – 4 and 7 – Motion estimation and compensation techniques – H.261 Standard

Video compression techniques and standards – MPEG Video Coding I: MPEG – 1 and 2 – MPEG Video Coding II: MPEG – 4 and 7 – Motion estimation and compensation techniques – H.261 Standard

Video compression techniques and standards – MPEG Video Coding I: MPEG – 1 and 2 – MPEG Video Coding II: MPEG – 4 and 7 – Motion estimation and compensation techniques – H.261 Standard

Video compression techniques and standards – MPEG Video Coding I: MPEG – 1 and 2 – MPEG Video Coding II: MPEG – 4 and 7 – Motion estimation and compensation techniques – H.261 Standard

Introduction: Services, Mechanisms and Attacks, OSI security Architecture, Model for network Security; Classical Encryption Techniques:Symmetric Cipher Model, Substitution Techniques, Transposition Techniques, Rotor Machines, Stegnography;

Introduction: Services, Mechanisms and Attacks, OSI security Architecture, Model for network Security; Classical Encryption Techniques:Symmetric Cipher Model, Substitution Techniques, Transposition Techniques, Rotor Machines, Stegnography;

Introduction: Services, Mechanisms and Attacks, OSI security Architecture, Model for network Security; Classical Encryption Techniques:Symmetric Cipher Model, Substitution Techniques, Transposition Techniques, Rotor Machines, Stegnography;

Introduction: Services, Mechanisms and Attacks, OSI security Architecture, Model for network Security; Classical Encryption Techniques:Symmetric Cipher Model, Substitution Techniques, Transposition Techniques, Rotor Machines, Stegnography;

Block Ciphers and Data Encryption Standard: Simplified DES, Block Cipher Principles, Data Encryption Standard, Strength of DES, Differential and Linear Crypt Analysis, Block Cipher Design Principles, Block Cipher Modes of Operation

Block Ciphers and Data Encryption Standard: Simplified DES, Block Cipher Principles, Data Encryption Standard, Strength of DES, Differential and Linear Crypt Analysis, Block Cipher Design Principles, Block Cipher Modes of Operation

Block Ciphers and Data Encryption Standard: Simplified DES, Block Cipher Principles, Data Encryption Standard, Strength of DES, Differential and Linear Crypt Analysis, Block Cipher Design Principles, Block Cipher Modes of Operation

Block Ciphers and Data Encryption Standard: Simplified DES, Block Cipher Principles, Data Encryption Standard, Strength of DES, Differential and Linear Crypt Analysis, Block Cipher Design Principles, Block Cipher Modes of Operation

2. David Salomon : Data Compression – The Complete Reference, Springer Verlag New York Inc., 4th Edition, 2006

3. Yun Q.Shi, HuifangSun : Image and Video Compression for Multimedia Engineering -  Fundamentals, Algorithms & Standards, CRC press, 2008

4.Jan Vozer : Video Compression for Multimedia, AP Profes, NewYork, 1995.

5. William Stallings, “Cryptography and Network Security”, 6th. Ed, Prentice Hall of India, New Delhi ,2013

6. William Stallings, “Network Security Essentials”, 5^thed. Prentice Hall of India, New Delhi

ESE-50

This course aims to provide an opportunity to seek, acquire and explore an appropriate level of technical skills through industry exposure.

Expose technical students to the industrial environment, whichcan not be simulated in the classroom and hence creating
competent professionals for the industry.

Provide possible opportunities to learn, understand and sharpen
the real time technical / managerial skills required at the job.
 Exposure to the current technological developments relevant to the
subject area of training.
 Experience gained from the ‘Industrial Internship’ will be used in
classroom discussions.
 Create conditions conducive to quest for knowledge and its
applicability on the job.

NA

Relevant literature and software tools for the chosen problem

Relevant literature and software tools for the chosen problem

The student is expected to carry out supervised research in this course. An intensive
literature in the chosen area, should result in sound knowledge in the area and result in the
identification of a suitable research problem, and its formulation and analysis. Study of
relevant supplementary literature, such mastering useful programming languages and
tools for the problem, are also expected at this stage of the project. The student is expected
to present three reports at different evaluation points duringthe semester, with clearly
defined achievements and plans for further steps.

Relevant literature and software tools for the chosen problem

v  Assessment of Project Work(Phase I)

§  Continuous Internal Assessment:100 Marks

¨      Presentation assessed by Panel Members

¨      Assessment by Guide

v  Assessment of Project Work(Phase II) and Dissertation

                                Continuous Internal Assessment:100 Marks

¨      Presentation assessed by Panel Members

¨      Assessment by Guide

§  End Semester Examination:100 Marks

¨      Viva Voce

¨      Demonstration

¨      Project Report

§  Dissertation (Exclusive assessment of Project Report): 100 Marks

¨      Internal Review : 50 Marks

¨      External review : 50 Marks

The student is expected to carry out supervised research in this course. An intensive
literature in the chosen area, should result in sound knowledge in the area and result in the
identification of a suitable research problem, and its formulation and analysis. Study of
relevant supplementary literature, such mastering useful programming languages and
tools for the problem, are also expected at this stage of the project. The student is expected
to present three reports at different evaluation points duringthe semester, with clearly
defined achievements and plans for further steps.

Relevant literature and software tools for the chosen problem

Relevant literature and software tools for the chosen problem

Relevant literature and software tools for the chosen problem

§  Continuous Internal Assessment:100 Marks

¨      Presentation assessed by Panel Members

¨      Assessment by Guide

v  Assessment of Project Work(Phase II) and Dissertation

                                Continuous Internal Assessment:100 Marks

¨      Presentation assessed by Panel Members

¨      Assessment by Guide

§  End Semester Examination:100 Marks

¨      Viva Voce

¨      Demonstration

¨      Project Report

§  Dissertation (Exclusive assessment of Project Report): 100 Marks

¨      Internal Review : 50 Marks

¨      External review : 50 Marks